Market Share of Electronic Packaging Industry
The electronic packaging market is fragmented. Microsystems are used almost in every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. Semiconductor devices, such as ICs, have become an integral part of a machine as electronics are getting integrated into machines, which is, in turn, driving the growth of electronic packaging significantly. Moving forward, acquisitions and collaboration of large companies with startups are expected, focusing on innovation.
In February 2022 , Siemens Digital Industries Software announced that it is working with Advanced Semiconductor Engineering (ASE), a leading semiconductor packaging supplier, on two platforms for multiple complex integrated circuits (IC) package assemblies and interconnects. Back in May 2021 , the Intel Corporation announced an investment of USD 3.5 billion to upgrade its facilities in New Mexico to manufacture advanced semiconductor packaging technologies, such as Foveros, Intel's innovative 3D packaging technology. Intel can create CPUs with computation tiles stacked vertically instead of side-by-side, owing to Foveros' innovative 3D packaging technique, which offers better performance in a smaller package.
Electronic Packaging Market Leaders
AMETEK Inc.
UFP Technologies, Inc.
E. I. du Pont de Nemours and Company
Sealed Air Corporation
Dordan Manufacturing Company
*Disclaimer: Major Players sorted in no particular order
