Market Size of Chemical Mechanical Polishing Industry
| Study Period | 2019 - 2029 |
| Market Size (2024) | USD 6.09 Billion |
| Market Size (2029) | USD 8.63 Billion |
| CAGR (2024 - 2029) | 7.23 % |
| Fastest Growing Market | Asia Pacific |
| Largest Market | Asia Pacific |
Major Players
*Disclaimer: Major Players sorted in no particular order |
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Chemical Mechanical Polishing Market Analysis
The Chemical Mechanical Polishing Market size is estimated at USD 6.09 billion in 2024, and is expected to reach USD 8.63 billion by 2029, growing at a CAGR of 7.23% during the forecast period (2024-2029).
Chemical Mechanical Polishing is an important process technology step in the semiconductor wafer fabrication process. In this process action, the top surface of the wafer is polished or planarized to produce a perfectly flat surface that is necessary to make more durable and more powerful semiconductor materials with the help of chemical slurry & mechanical movements. Traditional polishing is becoming old, and venders are anticipating one-stop solutions that could slice, probe, and polish in a separate assembly line, instead of using various machines that occupy a lot of land space and need high budget installation and heavy maintenance. Although such solutions are less common in the market currently, they are anticipated to be the next generation of polishing systems, over the forecast period.
- Growing performance requirements of electronic devices are creating the need for smaller and more robust semiconductors and electronic devices which, in turn, is driving the demand for newer fabrication materials and techniques, including CMP. An increase in the demand for electronic products has pushed the electronic packaging industry and customer expectations have raised regarding the features of new electronic devices.
- The other determinants driving the growth of the CMP market during the forecast period are the growing need of CMP for wafer planarization, high demand for consumer electronic products, and increasing use of micro-electro-mechanical systems (MEMS). In addition to that, with an expanding number of end-use applications such as IC manufacturing, micro-electro-mechanical systems (MEMS), optics, compound semiconductors, and computer hard drive manufacturing, the demand for chemical mechanical planarization or polishing is expected to expand.
