Market Share of 3D Sensing and Imaging Industry
The 3D sensing and imaging market is a highly competitive market. With increased innovations and sustainable products, to maintain their position in the global market, many companies are increasing their market presence by securing new contracts by tapping new markets. Some of the key developments are:
- February 2022 - STMicroelectronics, a semiconductor company, launched its new series of high-resolution Time-of-Flight sensors to provide advanced 3D depth imaging for smartphones and other devices. With the launch of the VD55H1 3D depth sensor, ST aims to strengthen its market position in the Time-of-Flight (ToF) product market and complement its full range of depth sensing technologies.
- January 2022 - LIPS Corporation announced its new LIPS Corp., a provider of 3D solutions, announced the new LIPSedge S215/S210 3D Stereo Cameras at CES 2022, based on CV2 CVflow edge AI perception SoC from Ambarella, a company offering AI perception processing. The new LIPSedge S Series 3D Stereo Camera can support up to 4K high-resolution and feature wide FOV, long range, and high accuracy.
- October 2021 - Lumentum Holdings Inc. introduced an industry-first 10 W flood illuminator module, which could integrate a high-performance three-junction vertical-cavity surface-emitting laser (VCSEL) array for industrial and consumer 3D sensing applications.
3D Sensing & Imaging Market Leaders
Infineon Technologies AG
Microchip Technology Inc.
Omnivision Technologies, Inc.
Qualcomm Inc
Sick AG
*Disclaimer: Major Players sorted in no particular order
