Market Share of Dicing Equipment Industry
The dicing equipment market is competitive and consists of several major players. These players, with a prominent share of the market, are focused on expanding their customer base across foreign countries. They leverage innovations to increase their recognition, market share, and profitability. Some major players operating in the market include Suzhou Delphi Laser Co. Ltd, ASM Laser Separation International (ALSI) BV, and Neon Tech Co. Ltd, among others.
In June 2022, SR, a wafer dicing saw machine maker, announced its plans wherein the company would focus on expanding the wafer dicing saw machine business. As part of its expansion plans, the company focused on supplying many saws to Samsung Electronics to dice camera modules. The company would also focus on expanding its presence to new sectors.
In October 2021, Northrop Grumman, the provider of dicing, backend wafer post-processing capabilities, soldier bumping, passivation, advanced inspection, and test solution, established wafer post-processing and test source tailored for defense applications further to expand its footprint into the defense microelectronics systems sector.
Dicing Equipment Market Leaders
Suzhou Delphi Laser Co. Ltd
SPTS Technologies Limited (KLA Tencor Corporation)
ASM Laser Separation International (ALSI) BV
Neon Tech Co. Ltd
Nippon Pulse Motor Taiwan (NPM) Group
*Disclaimer: Major Players sorted in no particular order
