Consumer Special Purpose Logic IC Market Size

Consumer Special Purpose Logic IC Market Analysis

The Consumer Special Purpose Logic IC Market is expected to witness a CAGR of 6.1% during the forecast period (2022-2027). The growing use of smartphones and tablets in consumer electronics segment is driving up demand for special purpose logic ICs, which is expected to move the global market for consumer special purpose logic ICs forward.

• Furthermore, demand for low-cost smartphones, combined with increasing Internet penetration, propels the worldwide special purpose logic IC market forward. The global special purpose logic IC market is growing due to the increasing use of logic ICs in industries other than electronics. Leading automotive businesses like Audi and Toyota are progressively requesting and offering electronic devices incorporated into their vehicles, driving the worldwide special purpose logic IC market forward.
• According to Ministry of Economy, Trade and Industry Japan, In 2021, the value of logic integrated circuits (ICs) produced in Japan was estimated to be around JPY 130.5 billion. Metal oxide semiconductor integrated circuits (Logic ICs) are a form of metal oxide semiconductor integrated circuit (MOS IC). This category also includes microcomputers, memory ICs, and miscellaneous MOS ICs, in addition to logic ICs. Such huge production value will create aopportunity for the Special purpose logic IC to grow.
• According to GSMA, the usage of 5G in GCC states will be slightly higher (16% customer 5G adoption) than the global average (15%) by 2025, mainly driven by governments and mobile operators with the support of mobile technology partners. Moreover, number of 5G subscriptions is expected to reach 129.62 million in Middle East and North African regions. With the increase in the adoption of 5g the demand for consumer special purpose IC will observe significant growth.
• The COVID-19 pandemic and work from home scenarios have also boosted the demand for certain segments in the consumer electronic market across the globe. In various global markets, demand for PCs and laptops witnessed a significant surge. Furthermore, gaming consoles & devices and fitness consumer devices witnessed record-break sales during the pandemic. For instance, in 2020, lower notebook ASPs were recorded, resulting from higher demand for consumer education PCs globally. Time spent on PCs has increased dramatically across all major usage categories, as well as the number of PCs per household.
• On the flip side, semiconductor fabs require vast amounts of liquid nitrogen to maintain the atmosphere within the facility and within specialisedsealed boxes known as front opening unified pods, or FOUPs, that are used to transport the wafers in order to assure optimal yield in the completed product. Further, IC substrate is thin and can easily be deformed, especially in protruding cases, when a board is less than 0.2mm thick. In order to overcome the difficulties, breakthroughs have to be made, in terms of board shrinking, lamination parameters, and layer positioning systems, in order to control substrate warpage and lamination thickness.